Micro-LED without encapsulation materials cannot meet the requirements to use; thus, a specific encapsulation is needed to provide mechanical protection, effective heat dissipation, electric connections, and high efficiency and quality light output. The encapsulation forms used on micro-LEDs are:
· Chip-type SMD encapsulation
· N-in-one IMD encapsulation
· COB encapsulation
The Challenge
The demand for high-power micro-LED is growing exponentially, so it becomes more relevant to increase the demand for encapsulation materials. The micro-LEDs are used in devices to enhance their efficiency and provide high brightness, which comes with the challenges like heat dissipation, outside protection, and transparent surface. High-power micro-LEDs have an advantage in the automotive application and general lighting owing to efficient working for extended operating hours and low maintenance costs.
For micro-LEDs, organic encapsulant materials used are acrylic resin, epoxy resin, and phenolic resin; and some of the inorganic encapsulant materials used are silicon nitride layer, silicon oxynitride layer, and silicon oxide layer. Moreover, the encapsulants provide thermal transfer and light emission, which align with the addressable need of mid-and high-power micro-LEDs. Thus, the micro-LED encapsulation market is expected to grow substantially during the forecast period.
